Thermally Conductive Adhesive for Improved Device Reliability

Master Bond’s thermally conductive adhesives dissipate heat in printed circuit board operations while still retaining desirable electrical performance.

Advanced adhesives have been formulated to provide a thermally conductive path between heat creating components. The proper selection of heat transfer compound will ensure secure operation which ultimately affects the reliability and lifespan of the electronic devices.

Master Bond’s thermal adhesives are available in one part epoxy and two part epoxy compound, silicone formulations and flexible adhesives featuring an impressive elongation ratio. Some of the more specialized systems are serviceable at very high temperatures, up to (650°F) or at cryogenic temperatures (4K). Also noteworthy are our NASA approved thermally conductive systems for high vacuum applications system.

Select Master Bond’s thermally conductive adhesives for advanced electronic packaging applications, we will be happy to offer you our years of expertise. contact us today.

Some of Our Most Popular Thermally Conductive Adhesives, Encapsulants, etc...

Product	Description
EP30AN-1	High thermal conductivity potting & bonding epoxy that meets NASA low outgassing specifications. Cures rigid.
EP37-3FLFAO	For potting & bonding. Good thermal conductivity. Cures flexible. Meets NASA low outgassing certification. Cryogenically serviceable.
EP21TDCANHT	High thermal conductivity. Flexibilized epoxy widely used for bonding dissimilar substrates.
EP21TCHT-1	High temperature resistant, thermally conductive epoxy. NASA low outgassing certified, Cryogenically serviceable.
SUPREME 10AOHT	No-mix, one part, thermally conductive epoxy adhesive/sealant. Unlimited working life at room temperature. Oven cures at 250-300°F. Excellent physical properties. Exceptional performance.
Download Our Thermally Conductive Product Selector Guide