NASA Authorized Low Outgassing Epoxy Adhesives for Electronics

Master Bond's electronically clean low outgassing epoxy adhesives are characterized by ultra high purity and no contaminants systems. They meet most stringent performance requirements for electronics grade adhesives, encapsulants and sealants. These low off-gassing products are successfully employed in applications ranging from disk drives and flat panel displays to advanced avionics and aerospace components. Master Bond's "low outgassing" epoxy adhesive compounds are manufactured with exceptionally high quality standards in order to assure high performance even under the most demanding service conditions.

The Master Bond product line of electronics industry polymers consists of both one part epoxy and two part epoxy systems available in a range of viscosities and cure speeds to best meet specific requirements. Master Bond's specialty low outgassing systems include cryogenically serviceable epoxies, electrically insulative and electrically conductive adhesives. Outstanding performance as both high temperature adhesives and low temperature adhesives is obtained over the exceptionally wide temperature range of +200°C to liquid helium temperatures. Particularly noteworthy is the fact that their outgassing properties exceed the widely employed ASM E595-84 test standards accepted by NASA for space applications where they find use as optical adhesives and thermal adhesives.

Contact our knowledgeable, experienced technical team today for help in selecting the perfect Master Bond low outgassing system for your application.

Some of Our Most Popular Low Outgassing Products...

Product	Description
EP29LPSP	Low viscosity, cryogenically serviceable epoxy with excellent physical properties for bonding or potting. Withstands cryogenic shocks. Superior electrical insulation properties. Optically clear.
EP21TCHT-1	Thermally conductive, two component epoxy with paste consistency. Cryogenically serviceable. High temperature resistant for bonding and sealing. Cures at room temperature.
EP37-3FLFAO	Thermally conductive, lower viscosity, easy-to-use epoxy system that cures flexible. Resistant to vibration, impact and shock. For potting & bonding.
EP30-2	Superior physical properties, excellent optical transmission characteristics, outstanding chemical resistance profile. Low viscosity enables easy application.
SUPREME 10HT	One part, no-mix system requiring oven curing at 250-300°F with extraordinary physical properties. High peel and tensile shear strength. Cryogenically serviceable. Resistant to vibration, thermal shock and impact.
Download Our Low Outgassing Product Selector Guide