Glob Top Epoxy for Precise Positioning and Bonding of Advanced Electronic Assemblies

Master Bond’s unique chip-on-board encapsulating epoxy, designed for glob top applications, provides improved operation and reliability to microelectronic components on printed circuit boards. A measured volume of epoxy adhesive deposited over a chip and its wire bonds is known to exclude contaminants, minimize the thermal mismatch between the chip and substrate, and enhance production throughput. These printed circuit board adhesives are available in two part epoxy, one part heat curable formulations and in UV cure glob top adhesives.

The full line of glob top materials for chip-on-board |COB] encapsulation offer a wide combination of properties.

Master Bond’s glob top epoxy formulations are:

• UV or heat curable systems
• Easy application
• Fast cure speeds
• Low stress
• Low shrinkage
• Thermal Adhesives
• Low outgassing
• Exceptional thermal conductivity
• High physical strength properties
• Superior electrical insulative properties
• Protects against humidity, high temperature & chemicals

Select Master Bond, an advanced adhesive manufacturer for your glob top material applications.

Some of Our Most Popular Glob Top Systems