Flip Chip Underfill Epoxy

Master Bond’s underfill epoxy compositions for integrated circuit packaging are interposed between chip and substrate to protect delicate semiconductors. Master Bond’s one part underfill epoxy is designed to reduce the CTE mismatch, a prevalent problem in IC processing, as the package is comprised of dissimilar materials. These highly flowable underfill epoxy adhesives produce uniform void-free epoxy layers to enhance the protection of the active die surfaces and improve stress distribution away from solder interconnects. Both highly insulative compounds and thermal adhesives are available.

The new Master Bond line of epoxy underfill offers key productivity parameters such as fast cure, low viscosity, and fast flow. A “no flow fluxing underfill” is available to simplify conventional flip chip assemblies, some of which can be fully cured during standard reflux cycles in-line processing. Featuring superior resistance to thermal temperature cycling as well as to mechanical shock and vibration the underfill compounds significantly improve long term reliability of the flip chip assembly.

Select Master Bond, a forefront underfill adhesive manufacturer, for your most critical microelectronic application needs.

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