Potting and Encapsulation Compounds Designed to Protect Electronic Assemblies

Master Bond’s potting and encapsulating compounds are designed to protect delicate circuitry from mechanical shock, thermal shock, vibration, chemical attack, humidity, extreme temperatures and thermal cycling. Worldwide manufacturers rely on Master Bond for their most crucial electronic assemblies such as relays, connectors, power supplies and surge suppressors applications. Technologically advanced, Master Bond’s potting and encapsulating compounds are designed to simplify processing requirements. They are freshly prepared on a per-order basis to ensure maximum shelf life.

Master Bond’s potting and encapsulating compounds consist of one part epoxy and two part epoxy systems and one part UV cure compounds. For potting circuit boards constructed with surface-mount technique, we offer low Tg silicones and polyurethane potting compounds to assure solder bond reliability. Our thermal adhesives are also applied in potting applications to provide heat dissipation management.

Select Master Bond, an advanced adhesive manufacturer with state of the art potting and encapsulation materials, for your most critical potting and encapsulating applications.

Some of Our Most Popular Potting & Encapsulation Systems...

Click here for more details...