Electronic Epoxy Adhesives Offer One Part and Two Part Epoxy Systems

Master Bond's one part epoxy and two part epoxy adhesives are used as a primary resin in the electronics industry. A full line of electronic adhesives for use in integrated circuits, transistors, hybrid circuits and for the assembly of printed circuit boards has been developed. Formulations include epoxy adhesive, epoxy sealant, epoxy coating, epoxy encapsulant and epoxy potting compounds comprised of both room-temperature curing and heat-curing polymer systems. Flexible epoxy potting compounds provide resistance to shock and vibration, and exclude moisture and corrosive agents.

Master Bond's epoxy adhesives offer a variety of curing schedules: room temperature cure or heat cure, special cold curing two part epoxy formulations and fast, snap curing adhesives.

Providing high strength bonds to a variety of substrates, these environmentally friendly epoxy compounds combine low toxicity with good physical properties, high chemical inertness and are NASA approved low outgassing adhesives for service in vacuum and cryogenic temperatures.

Other specialty epoxy compounds include fast UV cure epoxies, thermal adhesives for heat dissipation control, electrically conductive adhesives, optical adhesives offering optical clarity and a wide range of index of refraction options.