Electrically Conductive AdhesivesMaster Bond One And Two Component Electrically Conductive Adhesive Systems  Master Bond’s electrically conductive adhesives, sealants and coatings are designed for tomorrow’s advanced and demanding electronic industry. The electrically conductive adhesive line includes silver, nickel, copper and graphite filled compounds and cost effective silver coated nickel systems. Special electronic epoxy grades resist vibration and shock and provide high peel and shear strength bonds. Some electrically conductive adhesives could also be used as thermal adhesives, offering both heat and electrical conductivity. Specific conductive adhesives are serviceable at cryogenic temperatures and/or NASA approved for low outgassing. Conductive medical adhesives that fully meet the USP Class VI protocol are widely used in medical electronics applications.
Our electrically conductive adhesives consist of elastomeric and one and two part epoxy systems. For ease of use, they are available in syringes, jars, bubble packs, cartridges, etc. Two component epoxy adhesive systems can be purchased in premixed, frozen syringes. Freshly prepared to maximize shelf life. Contact us today for the most suitable electrically conductive adhesive. 
Some of Our Most Popular Electrically Conductive Adhesive Systems...
| EP21TDC/S |
Silver-filled, electrically conductive epoxy with low volume resistivity. Cryogenically serviceable. Good thermal cycling characteristics. Easy to process with a convenient 1:1 mix ratio. Superior physical strength properties. |
| EP21TDC/SFL |
Highly flexibilized version of EP21TDC/S silver-filled conductive epoxy. Superb for bonding & sealing dissimilar substrates. Enhanced thermal cycling properties. High peel and shear strength. |
| EP79 |
Cost effective alternative to silver-filled epoxy with a silver-coated nickel filler. Excellent conductivity and physical properties. |
| SUPREME 10HT/S |
Superb, silver-filled epoxy adhesive/sealant. One part, no mix system. Heat cures at 250-300°F. Cryogenically serviceable & high temperature resistant. Meets NASA low outgassing specifications. |
| EP76M |
Nickel-filled epoxy system. Widely used for EMI/RFI shielding applications. Easily processable with a 1:1 mix ratio. Cures at ambient temperatures. High bond strength. |
| EP75-1 |
Graphite-filled epoxy adhesive/sealant for use in specialty applications as well as EMI/RFI shielding where a non-metallic filler is required. Superb resistance to moisture and chemicals. Exceptional durability. |
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