Electrically Conductive Adhesives and Coatings Master Bond’s extensive line of electronic adhesives, sealants, conformal coatings, encapsulating and potting compounds is designed to meet the ever increasing demands of packaging design. Formulations consist of one part epoxy and two part epoxy systems, silicone adhesive sealants, polyurethanes and acrylic compounds, offering outstanding adhesive bonding strength. Many of our compounds have unique properties such as providing low stress environment for components and connections and eliminating CTE mismatch. Electrically insulative systems, thermal adhesives and electrically conductive adhesives are available.
Master Bond’s supplemental products for microelectronic assembly also include: *Glob Top Epoxy, a unique chip-on-board encapsulating epoxy for precise positioning and bonding of advanced electronic assemblies. *Conformal Coatings offering maximum PCB component protection from moisture, dust, chemicals, and temperature extremes. *Flip chip underfill epoxy that is interposed between chip and substrate to protect delicate semiconductors. *Die attach adhesive compounds adhere components directly onto printed circuitry. Select Master Bond, a forefront electronics grade adhesive manufacturer, for your most critical microelectronics assembly needs. Some of Our Most Popular Electronic Industry Adhesives and coatings...
Silver
Conductive |
EP21TDC/S |
Two part, room temperature curing, silver conductive epoxy with a service temperature range of 4K to 275°F. Excellent mechanical properties and high sheer and peel strength. One to one mix ratio and low volume resistivity <10-3 ohm-cm. |
| Underfill Potting |
EP3RR-1 |
This potting and underfill one part heat cured epoxy features a fast cure, as well as good heat resistance. Additionally, this product is thermally conductive, castable to 1 inch thick, and serviceable from -60º to 400ºF. |
| Thermal Conductive |
EP30AN-1 |
Two part, room temperature curing epoxy with good electrical insulation properties. Used primarily in potting and bonding. Low viscosity and good flow properties. Meets NASA low outgassing specifications and exhibits exceptional thermal conduction properties |
| Chemical Resistant |
EP41S-1 |
Two part, room temperature curing epoxy widely used as a bonding, coating, and potting epoxy where excellent solvent resistance is needed. Exhibits good flow properties and excellent bonding characteristics. |
| Low Outgassing |
SUPREME 10HT/S |
One part, heat cured system (125-150°C) with excellent electrical conductivity and physical properties. Widely used for die attach and chip bonding. Outstanding bonding and thermal cycling capabilities. |
| Silicone |
MASTERSIL 713 |
One part, room temperature curing RTV. Rapid setting with excellent flexibility, very low viscosity, and outstanding temperature resistance. Additionally, exhibits resistance to moisture, and is often used as a compound coating with remarkable repairability. |
| Shielding |
AC85 |
Acrylic based, silver conductive, one part system for EMI/RFI shielding. Surface resistivity <0.01-0.03 (ohm²). |  Download Electrically Conductive Selector Guide
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