Electronics Adhesive Manufacturer Attentive To Your Special Application Needs

Master Bond is a veteran electronics adhesives manufacturer providing the electronics packaging and PCB manufacturing industries with electronics grade polymers to enhance productivity yields, simplify handling, save time, and reduce waste. Master Bond’s adhesives, coatings and sealants for the electronics industry include over 3,000 grades of uniquely designed formulations. The specially engineered polymers used as conformal coatings, glob tops, die attach and for repair, differ in viscosity, cure speed, temperature resistance, chemical resistance, strength, electrical properties, color etc. These fine tuned electrically insulative or conductive adhesives are specifically designed to solve design, manufacturing and repair/maintenance problems.

A full line of potting & encapsulation compounds designed to meet the diverse needs of the microelectronics industry has been developed. Our line of microelectronic formulations consists of electronic epoxies, conductive silicone, polyurethane and acrylic compositions. Electrically conductive latex options exist as well. They include electrically insulative, thermally conductive and electrically conductive adhesive films and preforms. Both one and two component epoxy compounds are available for use in electronics assembly. These products are currently employed in applications ranging from heat sinking adhesives to glob tops to surface mounting polymers and from flip-chip technology to advanced die-attach processes. They will increase productivity, reduce waste, save energy and improve your products performance. They are the perfect solution in terms of adhesive performance and manufacturability.

If in our vast product-line, a compound is not available to meet your requirements, Master Bond Inc. will promptly formulate one. This may include the redesign of an existing product or the development of a new composition. Successful product reformulation and development encompass enhanced resistance to chemicals, high temperatures, shock and vibration as well as specific desired mechanical, electrical and thermal properties. Also viscosities and cure schedules can be adjusted for maximum productivity.

Master Bond’s line of adhesives and coatings for the electronics industry are currently employed in applications ranging from heat sinking to glob tops to surface mounting. Many of our compounds have unique properties such as low thermal expansion coefficients, exceptionally high thermal conductivity, low stress, etc. Master Bond is also actively engaged in developing new products to keep pace with the rapid technological advances in microelectronics ranging from flip-chip technology to advanced die-attach processes.